ICANN 2021

3rd International Conference on Advanced Nanomaterials and Nanodevices
第三届先进纳米材料与纳米器件国际会议
November 5-7, 2021
Virtual Conference
线上会议 | 2021年11月5-7日

Why Attend?

  • Presenting certified oral communications
  • Submitting your abstract and/or your extended abstracts for presentation only
  • Submitting your full length of paper to be included in Conference Proceedings
  • Hear from experts and meet new people in your field
  • Develop new collaborations, applications, and products of the mentioned fields
  • It will be a Socializing Events during the conference, you'll find it meaningful

Welcome to ICANN 2021

With the success of 1st edition in Shanghai, China and the 2nd edition in Shanghai University, China. 2021 3rd International Conference on Advanced Nanomaterials and Nanodevices (ICANN 2021) will be held in Shanghai, China during October 16-18, 2021 Virtual Platform during November 5-7, 2021.
ICANN 2021 is co-organized by Shanghai University and Jiaxing University. It focuses on Advanced Nanomaterials and Nanodevices for Nano engineering and recent advances in nanotechnology, covering fields from theory and experiment to applications of nanostructured materials and nanodevices in technology. ICANN 2021 intends to bring eminent scientists, technologists and young researchers from several disciplines across the globe together to provide a common platform for discussing their achievements and newer directions of research.
2021年第三届先进纳米材料与纳米器件国际会议将于2021年11月5-7日在线上平台举行。 本届会议由上海大学和嘉兴学院联合主办。会议主题聚焦于先进纳米材料与纳米器件,涵盖了纳米结构材料和纳米器件在技术上应用的理论与实验。 ICANN 2021旨在为全球范围内相关研究领域的专家、学者交流最新研究成果、探讨学术发展方向提供一个广泛的交流平台。 现热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。 会议通知下载

ICANN 2021会议信息已在嘉兴学院网站上公布!(点击查看

考虑到近期多地疫情反复,为了确保参会者的健康和安全,经组委员商量后决定 本届会议改为线上举行。并相应推迟会议日期至2021年11月5-7日以便大家有更多的时间准备稿件和报告。

Proceedings | 会议论文集

Submitted papers will be peer reviewed and accepted papers after proper registration and presentation will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus.
本次大会接收的文章将以论文集的形式出版在Materials Science Forum。论文集将被 EI Compendex 和 Scopus 收录检索, 欢迎广大学者踊跃投稿参会!


Submission | 投稿须知


Full Paper Submission 全文投稿 (Template Download)

Submitted paper should have no less than 5 pages. Accepted and registered paper will be invited for presentation and will be published after the conference.
Plagiarism is a serious professional misconduct. All submissions will be screened for plagiarism and when identified, the submissions will be rejected.

Abstract 摘要投稿 (Template Download)

Accepetd abstract will be invited for presentation. The abstract will not be published but will be included in conference program.


How to Submit? 投稿方式

Log in the Online Submission System
Fill all the the necessary information in "Paper info" form, upload abstract/paper file(.DOC or .PDF), and then click "Submit" button

Key Dates | 重要日期


Abstract Submission Due: October 20, 2021

摘要投稿截止日:2021年10月20日

Notification Date: October 25, 2021

通知发放日:2021年10月25日

Registration Due: November 1, 2021

注册截止日:2021年11月1日

Test Session Date: November 5, 2021

线上会议测试:2021年11月5日

Speech Date: November 6, 2021

特邀报告和文章报告:2021年11月6日

Speech Date: November 7, 2021

特邀报告和文章报告:2021年11月7日

Speakers


Prof. Xiaozhong Zhang
章晓中教授,清华大学


Prof. Soon Hyung Hong
洪淳亨教授,韩国KAIST


Prof. Chengzhong Yu
余承忠教授,昆士兰大学


Prof. Guozhen Shen
沈国震教授,中国科学院半导体研究所


Assoc. Prof. Jianyong Ouyang
欧阳建勇教授,新加坡国立大学


Prof. Zhi Yang
杨志教授,上海交通大学


Prof. Jun Zhang
张军教授,青岛大学


Assoc. Prof. Xiu-Li Yang
杨秀丽副教授,盐城工学院


Co-Organized by

Co-Sponsored by

     

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